The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Oct. 05, 2017
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Dirk Becker, Langquaid, DE;
Matthias Sperl, Mintraching, DE;
Assignee:
OSRAM OLED GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/16 (2006.01); H01L 31/02 (2006.01); H01L 25/16 (2006.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 31/16 (2006.01); H01L 33/00 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 31/02002 (2013.01); H01L 25/167 (2013.01); H01L 31/16 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/0025 (2013.01); H01L 33/0095 (2013.01); H01L 33/58 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A sensor includes a printed circuit board; at least one semiconductor chip arranged on the printed circuit board and includes a front-side contact, wherein the semiconductor chip is a radiation-detecting semiconductor chip; an embedding layer arranged on the printed circuit board and laterally adjoining the at least one semiconductor chip; and a contact layer connected to the front-side contact of the at least one semiconductor chip.