The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Feb. 19, 2019
Renesas Electronics Corporation, Tokyo, JP;
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Abstract
A hybrid-bonding-type solid-state imaging device is provided that prevents moisture from entering through the bonded interface and other areas. The solid-state imaging device includes a first interconnect structure over a sensor substrate and a second interconnect structure over a logic substrate, and the first and second interconnect structures are bonded together. At the bonded surface between the first and second interconnect structures, bonding pads formed in the first interconnect structure are bonded to bonding pads formed in the second interconnect structure. Eighth layer portions of a first seal ring formed in the first interconnect structure are bonded to eighth layer portions of a second seal ring formed in the second interconnect structure.