The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Sep. 13, 2016
Applicant:

Google Llc, Mountain View, CA (US);

Inventor:

Theodore Charles White, Mountain View, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 39/22 (2006.01); H01L 25/065 (2006.01); G06N 10/00 (2019.01); H01L 27/18 (2006.01); H01L 23/48 (2006.01); H01L 23/532 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01P 7/08 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G06N 10/00 (2019.01); H01L 23/481 (2013.01); H01L 23/53228 (2013.01); H01L 23/53257 (2013.01); H01L 23/53285 (2013.01); H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 25/50 (2013.01); H01L 27/18 (2013.01); H01P 7/086 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05179 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13179 (2013.01); H01L 2224/13183 (2013.01); H01L 2224/81409 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/04941 (2013.01);
Abstract

The proposed device includes a first chip () comprising a superconducting quantum bit and a second chip () bonded to the first chip, the second chip including a substrate () having first and second opposing surfaces. The first surface () facing the first chip includes a layer () of superconductor material which includes a first circuit element. The second chip further includes a second layer () on the second surface () which includes a second circuit element, and a through connector () that extends from the first surface to the second surface and electrically connects a portion of the superconductor material layer to the second circuit element.


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