The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Jan. 02, 2020
Applicant:
Gyh-bin Wang, Hsinchu County, TW;
Inventor:
Gyh-Bin Wang, Hsinchu County, TW;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 24/13 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06541 (2013.01);
Abstract
A semiconductor chip set with double-sided off-chip bonding structure in the disclosure comprises at least one first off-chip bonding structure formed above a first surface of the semiconductor chip set, and at least one second off-chip bonding structure formed above a second surface of the semiconductor chip set, wherein the first surface is opposite to the second surface and each of the first off-chip bonding structure and the second off-chip bonding structure is used for connecting to an electrical connecting point external to the semiconductor chip set through bonding wire, through-silicon via (TSV) or micro bump.