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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10978371 B1

PDFFull Text
Date of Patent:
Apr. 13, 2021

Filed:

Jan. 22, 2019

Semiconductor device and method for manufacturing semiconductor device

Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Kenshi Kai, Matsumoto, JP;

Rikihiro Maruyama, Matsumoto, JP;

Yoshihiro Miyazaki, Shiojiri, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:

David A Zarneke

Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 25/18 (2006.01); H01L 25/07 (2006.01); H01L 23/36 (2006.01); H01L 23/12 (2006.01); H01L 23/04 (2006.01); H01L 21/52 (2006.01); H01L 23/13 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 21/4803 (2013.01); H01L 21/4817 (2013.01); H01L 21/4882 (2013.01); H01L 21/52 (2013.01); H01L 23/04 (2013.01); H01L 23/041 (2013.01); H01L 23/10 (2013.01); H01L 23/12 (2013.01); H01L 23/13 (2013.01); H01L 23/36 (2013.01); H01L 23/3735 (2013.01); H01L 23/40 (2013.01); H01L 23/562 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4087 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A semiconductor device including an insulated circuit board on which a semiconductor chip is mounted, and a housing implemented by a plurality of side-walls including at least a first pair of facing side-walls, each of the facing side-walls having joint edges configured to be jointed with the insulated circuit board, and each of the joint edges has an arc-shape such that a center in an extending direction of the joint edge protrudes toward the insulated circuit board more than both ends of the extending direction of the joint edge.

Find Patent Forward Citations

Kai, Kenshi. (2021). Semiconductor device and method for manufacturing semiconductor device (U.S. Patent No. 10978371). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10978371

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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