The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Sep. 26, 2017
Applicants:

Prilit Optronics, Inc., Tainan, TW;

Himax Technologies Limited, Tainan, TW;

Inventors:

Biing-Seng Wu, Tainan, TW;

Chao-Wen Wu, Tainan, TW;

Tzung-Ren Wang, Tainan, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); H01L 21/67144 (2013.01); H01L 33/0095 (2013.01); H01L 21/6875 (2013.01); H01L 25/0753 (2013.01);
Abstract

A vacuum suction apparatus includes a semiconductor substrate with a top portion having grooves and a bottom portion having through holes, wherein each said groove correspondingly connects with at least one said through hole, and the groove has a width greater than a width of the through hole; and a cover plate disposed on a top surface of the semiconductor substrate. At least one edge of the vacuum suction apparatus has a vacuum chamber, which connects with the grooves. In another embodiment, the cover plate is replaced with a vacuum cover disposed above the semiconductor substrate, wherein the vacuum cover and the semiconductor substrate construct a vacuum chamber.


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