The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Feb. 12, 2019
Applicant:

Nhk Spring Co., Ltd., Yokohama, JP;

Inventor:

Hajime Arai, Kanagawa, JP;

Assignee:

NHK SPRING CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/127 (2006.01); H01R 31/00 (2006.01); G11B 5/48 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/18 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
G11B 5/4846 (2013.01); G11B 5/1272 (2013.01); G11B 5/486 (2013.01); G11B 5/4826 (2013.01); H05K 1/0245 (2013.01); H05K 1/0277 (2013.01); H05K 1/0298 (2013.01); H05K 1/18 (2013.01); H05K 1/189 (2013.01); H05K 3/0011 (2013.01); H05K 3/18 (2013.01); G11B 5/484 (2013.01); H05K 1/056 (2013.01); H05K 2201/05 (2013.01); H05K 2201/097 (2013.01); H05K 2201/09245 (2013.01); H05K 2201/2009 (2013.01); Y10T 29/49194 (2015.01);
Abstract

A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, includes write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities and further including a stacked interleaved part which includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities, is manufactured by a wiring step, an insulating layer forming step and a stacked interleaved part forming step.


Find Patent Forward Citations

Loading…