The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Mar. 25, 2020
International Business Machines Corporation, Armonk, NY (US);
Sven Peyer, Tuebingen, DE;
Christian Schulte, Boeblingen, DE;
International Business Machines Corporation, Armonk, NY (US);
Abstract
System and method for configuring via meshes for a semiconductor circuit having at least a bottom layer and a top layer each having a plurality of parallel conductive straps, and vias to interconnect straps in the bottom layer to the top layer to provide conductive routing pathways is disclosed. The method and system include inputting predefined criteria for the via mesh, and configuring feasible straps in the bottom layer of straps using a set of predefined rules and configuring feasible straps for the top layer, and optionally the intermediate layers using the set of predefined rules. The predefined criteria preferably includes one or all of: defining the bottom and top layer connection locations, defining a set of predefined tracks for each layer, defining the number of layers and straps in each layer, and combinations thereof.