The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2021
Filed:
Jul. 15, 2020
Inventec (Pudong) Technology Corporation, Shanghai, CN;
Inventec Corporation, Taipei, TW;
INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai, CN;
INVENTEC CORPORATION, Taipei, TW;
Abstract
A method for generating packing solution of printed circuit board (PCB) comprises: obtaining a plurality of component files, a first constraint, and a second constraint, wherein each of the component files corresponds to an electrical component, the first constraint corresponds to a signal-PCB, and the second constraint corresponds to a multiple-PCB; performing a genetic algorithm according to the plurality of component files and the first constraint files to generate a plurality of single-PCB feasible solutions, wherein each of the plurality of single-PCB feasible solutions has a shape description, performing a concave hull algorithm to update the shape description according to each of the plurality of single-PCB feasible solutions, after updating the shape description, performing the genetic algorithm according to the plurality of single-PCB feasible solutions and the second constraint to generate a multiple-PCB packing solution.