The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Jan. 29, 2019
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Michael Bowes, Scotts Valley, CA (US);

Atashi Basu, Menlo Park, CA (US);

Kapil Sawlani, San Jose, CA (US);

Dongyao Li, San Jose, CA (US);

Anand Chandrashekar, Fremont, CA (US);

David M. Fried, South Salem, NY (US);

Michal Danek, Cupertino, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06F 30/39 (2020.01); H01L 21/768 (2006.01); G06F 30/33 (2020.01);
U.S. Cl.
CPC ...
G06F 30/39 (2020.01); G06F 30/33 (2020.01); H01L 21/76883 (2013.01);
Abstract

Provided herein are systems and methods for optimizing feature fill processes. The feature fill optimization systems and methods may be used to optimize feature fill from a small number of patterned wafer tests. The systems and methods may be used for optimizing enhanced feature fill processes including those that include inhibition and/or etch operations along with deposition operations. Results from experiments may be used to calibrate a feature scale behavioral model. Once calibrated, parameter space may be iteratively explored to optimize the process.


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