The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Jun. 13, 2018
Applicant:

Sichuan University, Chengdu, CN;

Inventors:

Jianfeng Liu, Chengdu, CN;

Lu Wang, Chengdu, CN;

Jianliang Pei, Chengdu, CN;

Huining Xu, Chengdu, CN;

Wenxi Fu, Chengdu, CN;

Xiaozhang Lei, Chengdu, CN;

Jianhui Deng, Chengdu, CN;

Assignee:

SICHUAN UNIVERSITY, Chengdu, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01V 1/16 (2006.01); G01V 1/18 (2006.01); G01V 1/20 (2006.01); G01V 1/38 (2006.01); G01V 1/22 (2006.01);
U.S. Cl.
CPC ...
G01V 1/166 (2013.01); G01V 1/181 (2013.01); G01V 1/202 (2013.01); G01V 1/22 (2013.01); G01V 1/3817 (2013.01); G01V 1/3843 (2013.01); G01V 2210/123 (2013.01); G01V 2210/1232 (2013.01); G01V 2210/142 (2013.01); G01V 2210/1429 (2013.01);
Abstract

The present invention discloses a microseismic monitoring system, which includes at least a microseismic sensor, a push rod set at both ends of the microseismic sensor through the first connecting mechanism for sending the microseismic sensor into a monitoring hole, a guide mechanism installed on the push rod for guiding the microseismic sensor into the monitoring hole, and a microseismic monitoring computer connecting with the microseismic sensor signal. The microseismic sensor is reusable. The first connecting mechanism can make the push rod swing relative to the microseismic sensor. The guide mechanism is a three-roller guide mechanism. The present invention can satisfy the need of monitoring different locations in monitoring holes with large depths for multiple microseismic sensors, and solve problems of effective contact coupling between the microseismic sensors and monitoring holes, which improves the accuracy of microseismic monitoring and reduces the cost of a microseismic monitoring system.


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