The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Oct. 10, 2017
Applicant:

Endress+hauser Flowtec Ag, Reinach, CH;

Inventors:

Stephan Gaberthüel, Oberwil, CH;

Alexander Grün, Lörrach, DE;

Hanno Schultheis, Hermrigen, CH;

Tobias Baur, Reinach, CH;

Martin Barth, Riehen, CH;

Anastasios Badarlis, Birsfelden, CH;

Lars Neyerlin, Wahlen, CH;

Martin Arnold, Reinach, CH;

Oliver Popp, Oberwil, CH;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/68 (2006.01); G01F 1/688 (2006.01); G01F 15/00 (2006.01);
U.S. Cl.
CPC ...
G01F 1/6888 (2013.01); G01F 1/6884 (2013.01); G01F 15/00 (2013.01);
Abstract

The present disclosure relates to a method for manufacturing a probe of a thermal, flow measuring device for measuring mass flow of a liquid in a measuring tube, wherein the method includes: introducing a probe core including a hard solder and a core element into a first probe sleeve, wherein the first probe sleeve has an open first end and a closed second end away from the first end; melting the hard solder; affixing the core element by cooling the hard solder to a temperature less than the solidification temperature; and applying a thermoelement to a contact area of the core element or of the solidified hard solder. The present disclosure relates, furthermore, to a probe resulting from the manufacturing process as well as to a flow measuring device having at least one probe of the-present disclosure.


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