The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Mar. 27, 2019
Applicant:

Coretronic Corporation, Hsin-Chu, TW;

Inventors:

Wei-Chi Liu, Hsin-Chu, TW;

Tsung-Ching Lin, Hsin-Chu, TW;

Shi-Wen Lin, Hsin-Chu, TW;

Chi-Chuan Wang, Hsin-Chu, TW;

Yong-Dong Zhang, Hsin-Chu, TW;

Assignee:

Coretronic Corporation, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 3/02 (2006.01); F28F 9/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
F28F 3/02 (2013.01); F28F 9/001 (2013.01); H05K 7/20272 (2013.01); H05K 7/20409 (2013.01); H05K 7/20981 (2013.01); F28F 2215/04 (2013.01);
Abstract

A liquid cooled heat dissipation device including a housing, at least two cooling fin modules, an input pipe, and an output pipe is provided. The housing has an accommodation space. The at least two cooling fin modules are disposed in the accommodation space. The input pipe is disposed on the top plate, the front plate, the rear plate, or one of the side plates of the housing and communicates with the accommodation space. The output pipe is disposed on the top plate, the front plate, the rear plate, or the other one of the side plates of the housing and communicates with the accommodation space. The at least two cooling fin modules have different arrangement densities and different fin thicknesses.


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