The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Apr. 15, 2020
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Tomoharu Horio, Kyoto, JP;

Teruki Ono, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/232 (2016.01); H01L 25/075 (2006.01); H05K 3/28 (2006.01); F21V 15/00 (2015.01); F21V 23/00 (2015.01); F21V 29/74 (2015.01); F21V 29/89 (2015.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01); F21K 9/238 (2016.01); F21S 8/02 (2006.01); F21V 3/02 (2006.01); H01L 33/64 (2010.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
F21K 9/232 (2016.08); F21V 15/00 (2013.01); F21V 23/002 (2013.01); H01L 25/0753 (2013.01); H05K 3/282 (2013.01); F21K 9/238 (2016.08); F21S 8/026 (2013.01); F21V 3/02 (2013.01); F21V 23/006 (2013.01); F21V 29/74 (2015.01); F21V 29/89 (2015.01); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); H01L 33/644 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/4945 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/181 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0162 (2013.01); H05K 2201/2054 (2013.01);
Abstract

An LED lighting apparatus is disclosed. The LED lighting apparatus includes a substrate having a first surface; at least one connection body formed by LED chips arranged side by side in a first direction over the first surface of the substrate; and a circular protruding portion, arranged over the first surface of the substrate, surrounding the plurality of LED chips. The LED lighting apparatus further includes a first wiring pattern, arranged over the first surface of the substrate; and a second wiring pattern, arranged over the first surface of the substrate and spaced apart from the first wiring pattern.


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