The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Aug. 17, 2015
Applicant:

Okinawa Institute of Science and Technology School Corporation, Okinawa, JP;

Inventors:

Yabing Qi, Kunigami-gun, JP;

Matthew Ryan Leyden, Kunigami-gun, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 31/16 (2006.01); C23C 16/448 (2006.01); H01L 33/00 (2010.01); H01L 33/26 (2010.01); C23C 16/30 (2006.01); C30B 25/02 (2006.01); C30B 29/12 (2006.01); C30B 25/00 (2006.01); C30B 31/12 (2006.01); C23C 16/52 (2006.01); C30B 29/54 (2006.01); H01L 51/00 (2006.01); H01L 51/42 (2006.01); H01G 9/20 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
C30B 31/16 (2013.01); C23C 16/30 (2013.01); C23C 16/448 (2013.01); C23C 16/52 (2013.01); C30B 25/00 (2013.01); C30B 25/02 (2013.01); C30B 29/12 (2013.01); C30B 29/54 (2013.01); C30B 31/12 (2013.01); H01L 33/005 (2013.01); H01L 33/26 (2013.01); H01L 51/001 (2013.01); H01L 51/002 (2013.01); H01G 9/2009 (2013.01); H01L 51/4226 (2013.01); H01L 51/5012 (2013.01);
Abstract

A system and method for fabricating a perovskite film is provided, the system including a housing for use as a CVD furnace having first and second sections coupled with first and second temperature control units, respectively. The first and second sections correspond substantially to the upstream and downstream of gases, respectively. One or more substrates are loaded in the second section and controlled by the second temperature control unit, and an evaporation unit containing an organic halide material is loaded in the first section and controlled by the first temperature control unit. Each of the substrates is pre-deposited with a metal halide material. The inside of the housing is pumped down to a low pressure.


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