The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Jan. 09, 2018
Applicant:

Korea Institute of Science and Technology, Seoul, KR;

Inventors:

Munju Goh, Jeollabuk-do, KR;

Hyeonuk Yeo, Jeollabuk-do, KR;

Nam Ho You, Jeollabuk-do, KR;

Se Gyu Jang, Jeollabuk-do, KR;

Seokhoon Ahn, Jeollabuk-do, KR;

Young Soo Kim, Jeollabuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1333 (2006.01); C09K 19/38 (2006.01); C09K 19/12 (2006.01); C09K 19/30 (2006.01); C09K 19/32 (2006.01); C09K 19/22 (2006.01); C09K 19/16 (2006.01); C09K 19/24 (2006.01); C09K 19/34 (2006.01); C09K 19/20 (2006.01); C09K 19/04 (2006.01);
U.S. Cl.
CPC ...
C09K 19/388 (2013.01); C09K 19/12 (2013.01); C09K 19/16 (2013.01); C09K 19/22 (2013.01); C09K 19/24 (2013.01); C09K 19/3003 (2013.01); C09K 19/322 (2013.01); C09K 19/3411 (2013.01); C09K 2019/0448 (2013.01); C09K 2019/122 (2013.01); C09K 2019/2035 (2013.01); C09K 2019/3009 (2013.01); C09K 2019/323 (2013.01); C09K 2019/328 (2013.01);
Abstract

Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.


Find Patent Forward Citations

Loading…