The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Apr. 06, 2020
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo, JP;

Inventors:

Takumi Motoi, Tokyo, JP;

Toru Nishioka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B42D 1/00 (2006.01); G06K 19/077 (2006.01); B42D 25/40 (2014.01); G06K 19/02 (2006.01); B42D 25/305 (2014.01); B42D 25/24 (2014.01); B42D 25/455 (2014.01); B42D 25/46 (2014.01); B42D 25/475 (2014.01); G06K 19/07 (2006.01); B42D 25/328 (2014.01);
U.S. Cl.
CPC ...
B42D 1/007 (2013.01); B42D 1/00 (2013.01); B42D 25/24 (2014.10); B42D 25/305 (2014.10); B42D 25/40 (2014.10); B42D 25/455 (2014.10); B42D 25/46 (2014.10); B42D 25/475 (2014.10); G06K 19/02 (2013.01); G06K 19/077 (2013.01); G06K 19/0723 (2013.01); B42D 25/328 (2014.10);
Abstract

A thin hinged laminated body and a layout sheet for the hinged laminated body are provided. A hinged laminated body, equipped with: an IC module having an IC chip capable of performing contactless communication; a hinge layer having a hinge section which can be bound into a booklet; a non-hinge layer which is laminated onto the hinge layer and does not have a hinge part, wherein the hinge layer is disposed over the entire surface of the laminated body having the hinge, the hinge layer and the non-hinge layer have a housing hole penetrating across the two layers, and the IC module is housed and held inside the housing hole.


Find Patent Forward Citations

Motoi, Takumi. (2021). Hinged laminated body, layout sheet for hinged laminated body, and manufacturing method for hinged laminated body (U.S. Patent No. 10974534). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10974534

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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