The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Aug. 31, 2018
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Polly Wanda Chu, Painted Post, NY (US);

Michael Patrick Donovan, Painted Post, NY (US);

Timothy Michael Gross, Corning, NY (US);

Louis Mattos, Jr., Painted Post, NY (US);

Prakash Chandra Panda, Ithaca, NY (US);

Robert Lee Smith, III, Painted Post, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); B32B 17/06 (2006.01); B32B 7/12 (2006.01); H01L 51/00 (2006.01); B32B 17/10 (2006.01); G09F 9/30 (2006.01); B32B 3/16 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
B32B 17/064 (2013.01); B32B 7/12 (2013.01); B32B 17/1055 (2013.01); G06F 1/1641 (2013.01); G06F 1/1652 (2013.01); G09F 9/301 (2013.01); H01L 51/0097 (2013.01); B32B 3/16 (2013.01); B32B 2255/10 (2013.01); B32B 2307/536 (2013.01); B32B 2307/546 (2013.01); B32B 2315/08 (2013.01); B32B 2457/00 (2013.01); B32B 2457/20 (2013.01); G02F 1/133305 (2013.01); H01L 2251/5338 (2013.01); Y10T 428/24942 (2015.01); Y10T 428/26 (2015.01); Y10T 428/266 (2015.01);
Abstract

A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress σof at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress σat the first primary surface in tension, σ+σ<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.


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