The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Mar. 12, 2018
Applicant:

Abb Schweiz Ag, Baden, CH;

Inventor:

Martin Sedén, Västerås, SE;

Assignee:

ABB Schweiz AG, Baden, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22D 2/00 (2006.01); G01K 7/42 (2006.01); G01K 11/3206 (2021.01); G01K 7/02 (2021.01);
U.S. Cl.
CPC ...
B22D 2/00 (2013.01); G01K 7/02 (2013.01); G01K 7/427 (2013.01); G01K 11/3206 (2013.01); G01K 2213/00 (2013.01);
Abstract

A method of determining a temperature distribution in a mold plate of a mold for a metal-making process, wherein the method includes: obtaining a temperature value from each of a plurality of temperature sensors arranged in the mold plate, each temperature sensor being spaced apart from a respective reference point in the mold plate, determining for each temperature value a reference point temperature value at the corresponding reference point using either a respective linear function or a respective non-linear function, wherein a correction factor and correction term of the linear function or a set of parameters in a general non-linear formulation of the non-linear function is obtained from a plurality of initial temperature relationships, wherein each initial temperature relationship is between a simulated temperature at the corresponding temperature sensor in the mold plate and a simulated temperature at the corresponding reference point in the mold plate, each simulated temperature being obtained based on a respective simulation of a model of the mold plate for a unique mold plate condition where the thermal boundary conditions of the mold plate have been completely, explicitly and uniquely stated, and obtaining an estimated temperature distribution at the reference points in the mold plate by means of the reference point temperature values.


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