The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Sep. 08, 2017
Applicant:

Echonous, Inc., Redmond, WA (US);

Inventors:

Kelly James Koski, Bothell, WA (US);

Joel Dean Wetzstein, Mountlake Terrace, WA (US);

Greg Nieminen, Bothell, WA (US);

Assignee:

EchoNous, Inc., Redmond, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 8/00 (2006.01); H01L 41/311 (2013.01); H01L 41/338 (2013.01); B06B 1/06 (2006.01); H01L 41/29 (2013.01); H01L 41/047 (2006.01); H05K 1/18 (2006.01); B06B 1/02 (2006.01); H05K 1/11 (2006.01); H04R 17/00 (2006.01);
U.S. Cl.
CPC ...
A61B 8/4483 (2013.01); B06B 1/0215 (2013.01); B06B 1/0622 (2013.01); H01L 41/0475 (2013.01); H01L 41/29 (2013.01); H01L 41/311 (2013.01); H01L 41/338 (2013.01); H05K 1/112 (2013.01); H05K 1/189 (2013.01); B06B 2201/20 (2013.01); H04R 17/005 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10151 (2013.01);
Abstract

Flex circuits and methods for ultrasound transducers are provided herein. In at least one embodiment, an ultrasound device includes a plurality of transducer elements and a flex circuit. The flex circuit includes an insulating layer having a first surface and a second surface opposite the first surface. A plurality of first conductive pads is included on the first surface of the insulating layer, and each of the first conductive pads is electrically coupled to a respective transducer element. A plurality of second conductive pads are included on the second surface of the insulating layer, and each of the second conductive pads is electrically coupled to a respective first conductive pad and the respective transducer element.


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