The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Feb. 20, 2019
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Kenta Sato, Shiojiri, JP;

Yasushi Yoshikawa, Chino, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H03B 5/02 (2006.01); H03B 5/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H03B 5/02 (2013.01); H03B 5/32 (2013.01); H05K 1/115 (2013.01);
Abstract

An electronic circuit board includes a substrate having a multilayer structure including a ground layer, has at least one configuration in which, in a ground layer closest to a signal terminal of an oscillator, a region overlapping a signal terminal in a plan view is a non-forming region of a ground electrode, in a ground layer closest to a first wiring connecting the signal terminal of the oscillator and an input portion of an amplifier, a region overlapping the first wiring in the plan view is a non-forming region of a ground electrode, and in a ground layer closest to a second wiring connecting the signal terminal of the oscillator and an output portion of the amplifier, a region overlapping the second wiring in the plan view is a non-forming region of a ground electrode.


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