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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10972066 B1

PDFFull Text
Date of Patent:
Apr. 06, 2021

Filed:

Aug. 26, 2019

Laminated electronic component and method of manufacturing the same

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Kunihiro Miyahara, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Rakesh B Patel

Int. Cl.
CPC ...
H03H 1/00 (2006.01); H03H 7/01 (2006.01); H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/36 (2006.01); H01F 27/40 (2006.01); H01F 41/04 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/40 (2006.01); H03H 3/00 (2006.01); H05K 9/00 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H03H 1/00 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/36 (2013.01); H01F 27/40 (2013.01); H01F 41/041 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/40 (2013.01); H03H 3/00 (2013.01); H03H 7/0115 (2013.01); H05K 9/0007 (2013.01); H01F 2027/2809 (2013.01); H01P 11/007 (2013.01); H03H 2001/0085 (2013.01);
Abstract

A laminated electronic component includes a multilayer body including multiple insulator layers that are laminated and including a bottom surface, a top surface, and multiple side surfaces. The laminated electronic component includes a shield film provided on at least one side surface of the multilayer body. In the laminated electronic component, at least one step difference is provided along a ridge at which the bottom surface and a corresponding one of the side surfaces of the multilayer body are connected to each other, and the shield film includes an edge portion disposed within the at least one step difference.

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