The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Mar. 12, 2019
Autonetworks Technologies, Ltd., Mie, JP;
Sumitomo Wiring Systems, Ltd., Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
AUTONETWORKS TECHNOLOGIES, LTD., Mie, JP;
SUMITOMO WIRING SYSTEMS, LTD., Mie, JP;
SUMITOMO ELECTRIC INDUSTRIES, LTD. <, Osaka, JP;
Abstract
The heat dissipation of a circuit assembly is improved. A circuit assembly includes: a relay that includes a terminal and generates heat when energized/as a result of energization/due to being energized; a base member to which the relay is attached and in which a through hole is formed; a heat dissipation member that is provided on a side of the base member opposite to a side on which the relay is attached; a first busbar that is connected to the terminal of the relay at a position spaced apart from the base member; and a heat transfer member that is inserted into the through hole so as to be movable in a direction along the axial direction of the through hole, and that comes into contact with the first busbar and the heat dissipation member.