The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Dec. 05, 2016
Applicant:
Goertek, Inc., Weifang, CN;
Inventors:
Quanbo Zou, Weifang, CN;
Zhe Wang, Weifang, CN;
Assignee:
Goertek, Inc., Shandong, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02 (2006.01); H01S 5/042 (2006.01); H01S 5/183 (2006.01); H01S 5/42 (2006.01); H01S 5/0234 (2021.01); H01S 5/022 (2021.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0216 (2013.01); H01S 5/0217 (2013.01); H01S 5/0234 (2021.01); H01S 5/04256 (2019.08); H01S 5/18369 (2013.01); H01S 5/423 (2013.01); H01S 5/022 (2013.01); H01S 5/4093 (2013.01);
Abstract
A micro laser diode transfer method and a manufacturing method comprise: forming a bonding layer () on a receiving substrate (), wherein first type electrodes () are connected to the bonding layer (); bringing a first side of the micro laser diodes () on a carrier substrate () into contact with the bonding layer (), wherein the carrier substrate () is laser-transparent; and irradiating selected micro laser diodes () with laser from the side of the carrier substrate () to lift-off the selected micro laser diodes () from the carrier substrate (). This method may improve yield.