The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Nov. 10, 2016
Applicants:
Cornell University, Ithaca, NY (US);
Dongjin Semichem Co., Ltd., Incheon, KR;
Inventors:
Yong Lak Joo, Ithaca, NY (US);
Ling Fei, Ithaca, NY (US);
Sunchan Park, Gyeonggi-do, KR;
Seon Yeong Gong, Gyeonggi-do, KR;
Assignees:
CORNELL UNIVERSITY, Ithaca, NY (US);
DONGJIN SEMICHEM CO., LTD., Incheon, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 4/1395 (2010.01); H01M 4/62 (2006.01); H01M 4/134 (2010.01); H01M 10/0525 (2010.01); H01M 4/04 (2006.01); H01M 4/38 (2006.01); H01M 4/48 (2010.01); H01M 12/08 (2006.01);
U.S. Cl.
CPC ...
H01M 4/625 (2013.01); H01M 4/0404 (2013.01); H01M 4/0419 (2013.01); H01M 4/134 (2013.01); H01M 4/1395 (2013.01); H01M 4/386 (2013.01); H01M 4/48 (2013.01); H01M 10/0525 (2013.01); H01M 12/08 (2013.01); Y02E 60/10 (2013.01);
Abstract
Provided herein are high performance direct deposit electrodes that do not require the use of a binder, as well as processes of manufacturing the same by an electrospray process.