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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10971668 B1

PDFFull Text
Date of Patent:
Apr. 06, 2021

Filed:

Apr. 21, 2020

Light-emitting device package including a lead frame

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Ji-hoon Yun, Suwon-si, KR;

Jong-sup Song, Hwaseong-si, KR;

Seol-young Choi, Yongin-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

F. Chau & Associates, LLC

Primary Examiner:

Mohammad M Hoque

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H01L 27/02 (2006.01); H01L 29/866 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/60 (2013.01); H01L 24/13 (2013.01); H01L 27/0248 (2013.01); H01L 27/0255 (2013.01); H01L 29/866 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/16257 (2013.01); H01L 2224/17106 (2013.01); H01L 2224/81011 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/3512 (2013.01); H01L 2933/0033 (2013.01);
Abstract

A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.

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