The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Feb. 28, 2018
Applicant:

Mitsumi Electric Co., Ltd., Tokyo, JP;

Inventors:

Makoto Kitazume, Tokyo, JP;

Tadashi Ono, Tokyo, JP;

Toshiki Komiyama, Tokyo, JP;

Yuki Inugai, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/52 (2010.01); H01L 33/60 (2010.01); H01L 25/075 (2006.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01); H01L 23/31 (2006.01); H01L 33/46 (2010.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 21/563 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 25/0753 (2013.01); H01L 33/46 (2013.01); H01L 33/507 (2013.01); H01L 33/52 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method includes mounting a light emitting device on a board having electrodes on its surface, disposing a resin sheet containing a light conversion material so as to face the surface of the board and filling a space between the resin sheet and the board with a first light transmissive resin, covering a surface of the resin sheet opposite to a surface of the resin sheet covered with the first light transmissive resin, with a second light transmissive resin, forming a groove extending from a top surface of the second light transmissive resin to the board, filling the groove with light reflective resin and covering the top surface of the second light transmissive resin with the light reflective resin, removing the light reflective resin, and dicing the light emitting device by cutting along the light reflective resin.


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