The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

May. 13, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Masafumi Kuramoto, Anan, JP;

Tomohisa Kishimoto, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/26 (2010.01); H01L 33/32 (2010.01); H01L 33/34 (2010.01); H01L 33/44 (2010.01); H01L 33/56 (2010.01); H01L 23/00 (2006.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/26 (2013.01); H01L 33/32 (2013.01); H01L 33/34 (2013.01); H01L 33/44 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 33/64 (2013.01); H01L 33/647 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01025 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01063 (2013.01); H01L 2924/01066 (2013.01); H01L 2924/01067 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus. The surface mounted light emitting apparatus comprises the light emitting devicebased on GaN which emits blue light, the first resin moldingwhich integrally molds the first leadwhereon the light emitting deviceis mounted and the second leadwhich is electrically connected to the light emitting device, and the second resin moldingwhich contains YAG fluorescent material and covers the light emitting device. The first resin moldinghas the recesscomprising the bottom surfaceand the side surfaceformed therein, and the second resin moldingis placed in the recess. The first resin moldingis formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin moldingis formed from a thermosetting resin such as silicone resin.


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