The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Jul. 02, 2019
Applicant:

Flexenable Limited, Cambridge, GB;

Inventors:

William Reeves, Cambridge, GB;

Sharjil Siddique, Cambridge, GB;

Assignee:

FLEXENBLE LIMITED, Cambridge, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 31/0392 (2006.01); H01L 31/02 (2006.01); G02F 1/1333 (2006.01); G02F 1/133 (2006.01);
U.S. Cl.
CPC ...
H01L 31/03926 (2013.01); G02F 1/13306 (2013.01); G02F 1/133305 (2013.01); H01L 27/1469 (2013.01); H01L 27/14603 (2013.01); H01L 27/14605 (2013.01); H01L 27/14614 (2013.01); H01L 27/14616 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 31/02016 (2013.01); G02F 2202/28 (2013.01);
Abstract

An optoelectronic device comprising a unit, which unit comprises: a plurality of resiliently flexible sheet components bonded together, the resiliently flexible sheet components comprising: (i) a first sheet component comprising at least a stack of layers defining an array of pixel electrodes and electrical circuitry for independently addressing each pixel electrodes via addressing conductors outside the array of pixel electrodes; and (ii) a second sheet component bonded to a top surface of the first sheet component; wherein the device further comprises one or more driver chips bonded to the first sheet component in a location underlying the second component and for electrical contact between said addressing conductors and terminals of said one or more driver chips; and wherein the thickness of material in the unit in the region of the one or more driver chips is substantially the same as the thickness of material in the unit in the region of the array.


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