The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Jun. 24, 2019
Applicant:

Gio Optoelectronics Corp., Tainan, TW;

Inventor:

Chin-Tang Li, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01); H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 3/12 (2006.01); H05K 3/28 (2006.01); H01L 21/77 (2017.01); H01L 41/047 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1259 (2013.01); H01L 25/167 (2013.01); H01L 27/124 (2013.01); H01L 27/3253 (2013.01); H01L 27/3255 (2013.01); H05K 1/118 (2013.01); H05K 1/144 (2013.01); H05K 3/125 (2013.01); H05K 3/28 (2013.01); H01L 27/3248 (2013.01); H01L 41/0475 (2013.01); H01L 2021/775 (2013.01); H05K 2201/09445 (2013.01); H05K 2201/10977 (2013.01);
Abstract

An electronic device and manufacturing method of the electronic device are disclosed. The manufacturing method includes: providing a substrate; forming a thin film circuit on the substrate, wherein the thin film circuit comprises at least one thin film transistor and at least one conductive trace; forming at least one first connection pad on the substrate, wherein the first connection pad is electrically connected with the thin film transistor through the conductive trace; disposing the substrate on a driving circuit board, wherein the driving circuit board comprises at least one second connection pad adjacent to and corresponding to the first connection pad; and forming a conductive member covering at least a part of the second connection pad and the first connection pad, wherein the second connection pad is electrically connected with the first connection pad through the conductive member.


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