The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Nov. 16, 2017
3m Innovative Properties Company, St. Paul, MN (US);
Ankit Mahajan, Saint Paul, MN (US);
Mikhail L. Pekurovsky, Bloomington, MN (US);
Matthew S. Stay, Minneapolis, MN (US);
Daniel J. Theis, Mahtomedi, MN (US);
Ann M. Gilman, Woodbury, MN (US);
Shawn C. Dodds, St. Paul, MN (US);
Thomas J. Metzler, St. Paul, MN (US);
Matthew R. D. Smith, Woodbury, MN (US);
Roger W. Barton, Afton, MN (US);
Joseph E. Hernandez, Port Huron, MI (US);
Saagar A. Shah, Woodbury, MN (US);
Kara A. Meyers, Oakdale, MN (US);
James Zhu, Woodbury, MN (US);
Teresa M. Goeddel, St. Paul, MN (US);
Lyudmila A. Pekurovsky, Bloomington, MN (US);
Jonathan W. Kemling, Woodbury, MN (US);
Jeremy K. Larsen, Farmington, MN (US);
Jessica Chiu, Woodbury, MN (US);
Kayla C. Niccum, St. Paul, MN (US);
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Abstract
Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.