The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Aug. 07, 2019
Murata Manufacturing Co., Ltd., Kyoto, JP;
Katsunari Nakazawa, Kyoto, JP;
Takanori Uejima, Kyoto, JP;
Motoji Tsuda, Kyoto, JP;
Yuji Takematsu, Kyoto, JP;
Dai Nakagawa, Kyoto, JP;
Tetsuro Harada, Kyoto, JP;
Masahide Takebe, Kyoto, JP;
Naoya Matsumoto, Kyoto, JP;
Yoshiaki Sukemori, Kyoto, JP;
Mitsunori Samata, Kyoto, JP;
Yutaka Sasaki, Kyoto, JP;
Yuuki Fukuda, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high frequency module includes a transmission power amplifier, a bump electrode connected to the transmission power amplifier, and a mounting board on which the transmission power amplifier is mounted, wherein the mounting board includes a via conductor having an elongated shape in the plan view of the mounting board, a board main part placed outside the via conductor, and an insulating part placed inside the via conductor, and the bump electrode and the via conductor are connected while at least partially overlapping each other in the foregoing plan view, and the board main part and the insulating part are each composed of an insulating material of the same kind.