The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Sep. 07, 2018
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Liqiang Chen, Beijing, CN;

PaoMing Tsai, Beijing, CN;

Jianwei Li, Beijing, CN;

Dejun Bu, Beijing, CN;

Shuang Du, Beijing, CN;

Can Zheng, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 27/1244 (2013.01); H01L 27/1262 (2013.01); H01L 27/3244 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 27/1218 (2013.01); H01L 2224/10125 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/14152 (2013.01); H01L 2224/14154 (2013.01); H01L 2224/14155 (2013.01); H01L 2224/14515 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17517 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/1426 (2013.01);
Abstract

The present disclosure provides a driving chip, a display substrate, a display device and a method for manufacturing a display device. The driving chip according to the present disclosure includes a substrate; and a plurality of connecting bumps and a plurality of supporting bumps disposed on the substrate. The plurality of connecting bumps include at least one set of connecting bumps arranged along a first direction, and the plurality of supporting bumps include the supporting bump that is located between the adjacent connecting bumps arranged along the first direction.


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