The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Feb. 26, 2018
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H04B 1/38 (2015.01); H04B 1/04 (2006.01); H04B 1/18 (2006.01); H03F 3/24 (2006.01); H01L 23/055 (2006.01); H01L 23/16 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 25/16 (2006.01); H03F 3/195 (2006.01); H03F 3/21 (2006.01); H03F 3/213 (2006.01); H03H 9/05 (2006.01); H01L 23/00 (2006.01); H03H 7/38 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/04 (2013.01); H01L 23/055 (2013.01); H01L 23/10 (2013.01); H01L 23/16 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H01L 25/162 (2013.01); H01L 25/165 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H03F 3/213 (2013.01); H03F 3/245 (2013.01); H04B 1/0458 (2013.01); H04B 1/18 (2013.01); H04B 1/38 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/14215 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H03F 2200/111 (2013.01); H03F 2200/168 (2013.01); H03F 2200/222 (2013.01); H03F 2200/294 (2013.01); H03F 2200/411 (2013.01); H03F 2200/451 (2013.01); H03F 2203/21103 (2013.01); H03F 2203/21112 (2013.01); H03F 2203/21157 (2013.01); H03H 7/38 (2013.01); H03H 9/0542 (2013.01); H03H 9/0547 (2013.01);
Abstract
A high-frequency module () includes a first substrate (), a second substrate () that faces the first substrate (), a support () that supports the first substrate () and the second substrate (), and a plurality of high-frequency circuit components arranged in internal space formed by the first substrate (), the second substrate (), and the support and on both of facing principal faces of the first substrate () and the second substrate (), and the plurality of high-frequency circuit components include a power amplifier element that constitutes a power amplifier circuit ().