The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Jun. 24, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Chih-Chao Yang, Glenmont, NY (US);

Baozhen Li, South Burlington, VT (US);

Andrew Tae Kim, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 27/11 (2006.01); H01L 23/525 (2006.01); H01L 27/112 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5256 (2013.01); H01L 23/481 (2013.01); H01L 27/11206 (2013.01);
Abstract

An electrode structure is located at least partially in a via opening having a small feature size and containing a fuse element which is composed of a fuse element-containing seed layer that is subjected to a reflow anneal. The electrode structure is composed of a material having a higher electromigration (EM) resistance than the material that provides the fuse element. Prior to programming, the fuse element is present along sidewalls and a bottom wall of the electrode structure. After programming, a void is formed in the fuse element along at least one sidewall of the electrode structure and the resistance of the device will increase sharply.


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