The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Sep. 20, 2019
Applicant:

Silanna Asia Pte Ltd, Singapore, SG;

Inventors:

Ariel Tan, Langkaan Dasmarirnas Cavite, PH;

Ren Huei Tzeng, San Diego, CA (US);

Assignee:

Silanna Asia Pte Ltd, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/28 (2006.01); H01L 21/56 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4951 (2013.01); H01L 21/56 (2013.01); H01L 23/28 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 2021/6027 (2013.01);
Abstract

Disclosed is a device including a lead frame having a body with a top surface and a bottom surface and lead fingers. Each lead finger has a first end and a second end. A semiconductor die is coupled to the body. A first flag is a first exposed portion of the body and integral with the first end of a first lead finger. The first flag and the first lead finger are a continuous material. A second flag is a second exposed portion of the body and integral with the first end of a second lead finger. The second flag and the second lead finger are a continuous material. An encapsulant covers the die, the bottom surface of the body, the first end of the lead fingers and a portion of the top surface of the body. The flags are separated and electrically isolated from one another by the encapsulant.


Find Patent Forward Citations

Tan, Ariel. (2021). Lead frame package having conductive surface with integral lead finger (U.S. Patent No. 10971434). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10971434

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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