The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Oct. 30, 2018
Applicant:

Kaistar Lighting (Xiamen) Co., Ltd, Xiamen, CN;

Inventor:

Jingqiong Zhang, Xiamen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 23/495 (2006.01); H01L 33/62 (2010.01); H01L 25/13 (2006.01); H01L 23/498 (2006.01); H01L 25/075 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 23/49586 (2013.01); H01L 23/49861 (2013.01); H01L 25/0753 (2013.01); H01L 25/13 (2013.01); H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 2224/48137 (2013.01);
Abstract

A surface mounted type leadframe includes a conductive base and an insulating material layer. The conductive base includes at least three connecting pads spaced apart from each other. First surface of the connecting pads are configured to form die bonding regions, and second surfaces of the connecting pads opposite to the first surfaces are configured to form soldering regions. The insulating material layer at least partially covers the first surfaces, surrounds the die bonding regions, and is filled in a gap between each two adjacent connecting pads. A photoelectric device with multi-chips adopting the surface mounted type leadframe is also provided.


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