The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Apr. 14, 2017
Applicant:
Kyocera Corporation, Kyoto, JP;
Inventor:
Takeshi Muneishi, Kyoto, JP;
Assignee:
KYOCERA Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); H01L 23/36 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/31 (2006.01); H01L 23/34 (2006.01); H05K 7/20 (2006.01); H01L 21/48 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/4882 (2013.01); H01L 23/3731 (2013.01); H01L 23/3735 (2013.01); H01L 23/49562 (2013.01); H01L 23/49568 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/07 (2013.01); H01L 25/071 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H05K 7/20 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/92225 (2013.01);
Abstract
A semiconductor device may include a cooling unit, the cooling unit including a circuit unit, a first flow path member comprised of an insulating material, and a second flow path member comprised of an insulating material. The circuit unit may include a heat sink layer, a wiring layer, and a semiconductor element that is disposed between the heat sink layer and the wiring layer. The circuit unit is disposed between the first flow path member and the second flow path member. The wiring layer may face the first flow path member or the second flow path member.