The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Feb. 04, 2019
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Qinghong He, Austin, TX (US);

Edward Davis Geist, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); F28F 27/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); F28F 27/00 (2013.01); H01L 2023/4056 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01);
Abstract

Thermal coupling with between an electrical component, such as a CPU, and a heatsink can be provided by a movable heatsink insert separate from the heatsink. This movable heatsink insert can be placed on the electrical component. The heatsink can be thermally coupled to that additional thermal conductor. The heatsink, which is attached to the printed circuit board, is not in direct contact with the electrical component, reducing the likelihood that the heatsink could cause bending of the printed circuit board by pressing down on the electrical component. Further, a spring coupled between the heatsink and the movable heatsink insert can provide further pressure relief such that the heatsink assembly can be attached to an electrical component without applying excessive force to the electrical component.


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