The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Sep. 17, 2019
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Bradley Paul Barber, Acton, MA (US);

Kezia Cheng, Lowell, MA (US);

Assignee:

SKYWORKS SOLUTIONS, INC., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); B81B 7/0077 (2013.01); H01L 21/56 (2013.01); H01L 23/3157 (2013.01); H01L 24/26 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/078 (2013.01); H01L 2924/1611 (2013.01); H01L 2924/1615 (2013.01); H01L 2924/183 (2013.01); H01L 2924/186 (2013.01); H01L 2924/1811 (2013.01); H01L 2924/1815 (2013.01);
Abstract

According to various aspects and embodiments, a support structure for packaging an electronic device is provided. In one example, a packaged electronic device includes a substrate, at least one electronic device disposed on the substrate, an encapsulation structure disposed on the substrate and having a wall that forms a perimeter around the at least one electronic device, and at least one support structure formed from a photosensitive polymer and disposed adjacent the wall of the encapsulation structure. The at least one support structure has a configuration that provides at least one of increased adhesion and mechanical strength to the encapsulation structure.


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