The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Jan. 30, 2020
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Takashi Katsuki, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 23/10 (2013.01); H01L 23/293 (2013.01); H01L 23/3142 (2013.01);
Abstract

A case includes a terminal disposition portion which includes a disposition surface projecting from an inner wall surface toward an open area, exposes an exposure region on a front surface of an external connecting terminal, and embeds therein a rear surface of the external connecting terminal. In the case, at at least part of both sides along a pair of opposite sides of the exposure region, the disposition surface is located between the front surface and the rear surface to have a level difference to the front surface. In a semiconductor device with the above-described configuration, the case does not extend to the exposure region on the front surface of the external connecting terminal. Therefore, no encapsulation resin flows into an interfacial debonding gap between the external connecting terminal and the case, thus curbing further advance of the interfacial debonding.


Find Patent Forward Citations

Loading…