The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Feb. 15, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/18 (2006.01); H01L 21/20 (2006.01); B29C 65/00 (2006.01); B29C 65/78 (2006.01); B32B 37/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); H01L 21/187 (2013.01); H01L 21/2007 (2013.01); H01L 21/687 (2013.01); B29C 65/002 (2013.01); B29C 65/7841 (2013.01); B29C 66/345 (2013.01); B29C 66/452 (2013.01); B29C 66/81422 (2013.01); B29C 66/81425 (2013.01); B29C 66/81455 (2013.01); B29C 66/92 (2013.01); B32B 37/10 (2013.01); B32B 2457/14 (2013.01);
Abstract
A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.