The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Sep. 13, 2019
Sumco Corporation, Tokyo, JP;
Kenji Yamashita, Tokyo, JP;
SUMCO CORPORATION, Tokyo, JP;
Abstract
Example features relate to a method of polishing a chamfered wafer surface, the method including beveling a wafer to generate the chamfered wafer surface, the chamfered wafer surface being inclined with respect to a main wafer surface by an angle θ; and polishing the chamfered wafer surface with a polishing pad, a polishing surface of the polishing pad being inclined with respect to the chamfered wafer surface by an angle α; wherein the angle α is equal to or smaller than the angle θ. Example features relate to a system for polishing the chamfered surface, the system including a polishing pad mounting jig configured to polish the chamfered surface, an angle θ being defined between the chamfered surface and the main surface; and a polishing pad in contact with the chamfered surface at an angle α during polishing; wherein the angle α is smaller than the angle θ.