The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
May. 31, 2019
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Yukihiro Fujita, Nagaokakyo, JP;
Shogo Kanbe, Nagaokakyo, JP;
Kosuke Nakano, Nagaokakyo, JP;
Hideki Otsuka, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 2/06 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/252 (2006.01);
U.S. Cl.
CPC ...
H01G 2/065 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01G 4/12 (2013.01); H01G 4/252 (2013.01);
Abstract
A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.