The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Apr. 02, 2018
Applicants:

Gleb M. Akselrod, Bellevue, WA (US);

Erik Edward Josberger, Seattle, WA (US);

Mark C. Weidman, Bellevue, WA (US);

Inventors:

Gleb M. Akselrod, Bellevue, WA (US);

Erik Edward Josberger, Seattle, WA (US);

Mark C. Weidman, Bellevue, WA (US);

Assignee:

Elwha LLC, Bellevue, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); G03H 1/02 (2006.01); C23C 28/00 (2006.01); C25D 5/02 (2006.01); C25D 5/34 (2006.01); C23C 14/34 (2006.01); C23C 14/18 (2006.01); C23C 14/02 (2006.01); C25D 5/48 (2006.01);
U.S. Cl.
CPC ...
C23C 28/322 (2013.01); C23C 14/021 (2013.01); C23C 14/185 (2013.01); C23C 14/34 (2013.01); C23C 28/34 (2013.01); C25D 3/38 (2013.01); C25D 5/02 (2013.01); C25D 5/34 (2013.01); C25D 5/48 (2013.01); G03H 1/02 (2013.01); G03H 2240/21 (2013.01); G03H 2260/62 (2013.01);
Abstract

The disclosure provides a method for fabricating a metallic optical metasurface having an array of hologram elements. The method includes forming a first copper layer protected with a conducting or dielectric barrier layer over a backplane structure by a damascene process. The first copper layer comprises a plurality of nano-gaps vertically extending from the backplane structure. The plurality of nano-gaps is filled with a dielectric material. The method also includes removing the dielectric material and a portion of the conducting or dielectric barrier layer to expose the portions in the nano-gaps of the first copper layer. The method may further include depositing a dielectric coating layer over the top portion and exposed side portions of the first copper layer to form a protected first copper layer, and filling the gaps with an electrically-tunable dielectric material that has an electrically-tunable refractive index.


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