The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Dec. 13, 2017
Applicant:

Arkema France, Colombes, FR;

Inventors:

Alaaeddin Alsbaiee, King of Prussia, PA (US);

Evan Crocker, Downingtown, PA (US);

Dana Lee Swan, Spring City, PA (US);

Assignee:

Arkema France, Colombes, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 120/14 (2006.01); C08K 5/17 (2006.01); C08J 5/10 (2006.01);
U.S. Cl.
CPC ...
C08F 120/14 (2013.01); C08J 5/10 (2013.01); C08K 5/17 (2013.01); C08J 2333/12 (2013.01); C08K 2201/014 (2013.01);
Abstract

The invention relates to the use of low levels of aliphatic primary and secondary amines to control air void formation in any polymerization reaction having carbonyl groups, and especially carboxylic acid ester group-containing monomers at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The primary or secondary amines are used in the polymerization mixture at levels of 100 to 5000 ppm, based on the carboxylic acid ester group-containing monomer. It is believed the primary and secondary amines hydrogen bond with the —C═O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methymethacrylate polymers and copolymers, either neat, or as a polymer composite system.


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