The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Mar. 20, 2018
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventor:
Shinji Yamamoto, Suita, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B23K 20/227 (2006.01); B23K 20/04 (2006.01); H01M 10/6554 (2014.01); B21B 3/00 (2006.01); C21D 1/26 (2006.01); C21D 1/32 (2006.01); C22F 1/08 (2006.01); H01L 23/36 (2006.01); B32B 15/20 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); B32B 37/10 (2006.01); B32B 38/00 (2006.01); B23K 103/04 (2006.01); B23K 103/12 (2006.01); C22C 38/44 (2006.01); B23K 103/16 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); H01M 10/653 (2014.01); B21B 1/38 (2006.01);
U.S. Cl.
CPC ...
B32B 15/013 (2013.01); B21B 3/00 (2013.01); B23K 20/04 (2013.01); B23K 20/227 (2013.01); B32B 15/01 (2013.01); B32B 15/015 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 37/1036 (2013.01); B32B 38/0036 (2013.01); C21D 1/26 (2013.01); C21D 1/32 (2013.01); C22F 1/08 (2013.01); H01L 23/36 (2013.01); H01M 10/6554 (2015.04); B21B 1/38 (2013.01); B21B 2001/386 (2013.01); B21B 2003/005 (2013.01); B23K 2103/05 (2018.08); B23K 2103/12 (2018.08); B23K 2103/166 (2018.08); B32B 2038/0048 (2013.01); B32B 2038/0076 (2013.01); B32B 2305/72 (2013.01); B32B 2311/12 (2013.01); B32B 2311/30 (2013.01); C21D 2251/02 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/44 (2013.01); H01M 10/653 (2015.04); Y02E 60/10 (2013.01); Y10T 428/12882 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12917 (2015.01); Y10T 428/12924 (2015.01); Y10T 428/12951 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12965 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/249921 (2015.04); Y10T 428/26 (2015.01); Y10T 428/266 (2015.01);
Abstract
A clad material includes a first layer made of stainless steel and a second layer made of Cu or a Cu alloy and roll-bonded to the first layer. In the clad material, a grain size of the second layer measured by a comparison method of JIS H 0501 is 0.150 mm or less.