The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Jan. 09, 2020
Applicant:
Nichia Corporation, Anan, JP;
Inventors:
Motokazu Yamada, Tokushima, JP;
Masakazu Kotani, Tokushima, JP;
Tetsuji Seino, Anan, JP;
Shinsaku Ikuta, Tokushima, JP;
Assignee:
NICHIA CORPORATION, Anan, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); H01L 33/54 (2010.01); H01L 33/00 (2010.01); B29K 83/00 (2006.01); B29K 105/04 (2006.01); B29L 31/34 (2006.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
B29D 11/00865 (2013.01); B29D 11/0074 (2013.01); B29D 11/00807 (2013.01); H01L 33/00 (2013.01); H01L 33/54 (2013.01); B29K 2083/00 (2013.01); B29K 2105/04 (2013.01); B29K 2995/0018 (2013.01); B29L 2031/3481 (2013.01); H01L 33/505 (2013.01); H01L 2933/005 (2013.01);
Abstract
A method of manufacturing a light emitting device includes providing a substrate on which a light source is disposed. An underfill material is ejected from a nozzle onto the substrate substantially around the light source in a circular shape, a shape of a letter 'C', or a rectangular shape. A covering member having a recess portion is provided above the light source.