The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

May. 12, 2016
Applicants:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Vicente Granados Asensio, Sant Cugat del Valles, ES;

Emilio Lopez Matos, Sant Cugat del Valles, ES;

Ismael Chanclon Fernandez, Sant Cugat del Valles, ES;

Jorge Castano Aspas, Sant Cugat del Valles, ES;

Salvador Sanchez Ribes, Sabadell, ES;

Luis Garcia Garcia, Les Roquetes, ES;

Carmen Blasco, Barcelona, ES;

Inventors:

Vicente Granados Asensio, Sant Cugat del Valles, ES;

Emilio Lopez Matos, Sant Cugat del Valles, ES;

Ismael Chanclon Fernandez, Sant Cugat del Valles, ES;

Jorge Castano Aspas, Sant Cugat del Valles, ES;

Salvador Sanchez Ribes, Sabadell, ES;

Luis Garcia Garcia, Les Roquetes, ES;

Carmen Blasco, Barcelona, ES;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/386 (2017.01); H04L 29/06 (2006.01); B33Y 30/00 (2015.01); B33Y 50/00 (2015.01); B29C 64/255 (2017.01);
U.S. Cl.
CPC ...
B29C 64/386 (2017.08); B29C 64/255 (2017.08); B33Y 30/00 (2014.12); B33Y 50/00 (2014.12); H04L 63/0428 (2013.01); H04L 63/06 (2013.01); H04L 63/08 (2013.01); H04L 63/0853 (2013.01);
Abstract

In an example, a data unit includes a mounting to removably mount the data unit on a receiving portion of an additive manufacturing build material container, a data source to provide data comprising a plurality of additive manufacturing parameters and a communications interface to communicate with a reader of an additive manufacturing build material processing apparatus. The communications interface is to transmit data from the data source to the additive manufacturing build material processing apparatus.


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