The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 06, 2021

Filed:

Jan. 24, 2017
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Hideaki Shirai, Kariya, JP;

Koichiro Yasuda, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2014.01); B23K 26/06 (2014.01); B23K 26/073 (2006.01); B23K 26/064 (2014.01); B23K 26/382 (2014.01); F02M 61/18 (2006.01); F02M 61/16 (2006.01); B23K 26/388 (2014.01); B23K 26/03 (2006.01);
U.S. Cl.
CPC ...
B23K 26/0648 (2013.01); B23K 26/064 (2015.10); B23K 26/0665 (2013.01); B23K 26/073 (2013.01); B23K 26/388 (2013.01); B23K 26/389 (2015.10); F02M 61/168 (2013.01); F02M 61/184 (2013.01); F02M 61/1833 (2013.01); B23K 26/032 (2013.01); F02M 2200/8069 (2013.01);
Abstract

A method for manufacturing a member having a through hole includes a primary formation step, an intensity determination step, a laser modulation step, and a secondary formation step. The primary formation step includes radiating a laser beam to a workpiece member to form a pilot hole having a smaller inner diameter than the through hole while receiving light from the workpiece member at a light detection unit. The intensity determination step includes determining whether a light intensity is equal to or less than a predetermined threshold value. The laser modulation step includes modulating a spatial light phase of the laser beam the intensity of the light is equal to or less than the predetermined threshold value. The secondary formation step includes radiating the laser beam having the modulated spatial light phase to a peripheral part of the pilot hole to form the through hole.


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